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SOLDAVAC SMT Reflow Vacuum Work Station
TSX70-230
- This ground-breaking technology introduces the most effective and innovative site preparation system for BGA’s, PLCC’s, QFP’s and other fine pitch devices using hot air reflow and desoldering functions from one handpiece
- Nitrogen capable to reduce oxidation and bridging
- Dual controls for hot gas and tip temperatures to produce even heating of board
- Recommended and utilized by major manufacturers
- International models available
- ESD safe
- 18 month warranty
- lead free
| Contents | |
|---|---|
| TSX70 | SMT reflow vacuum workstation includes TSX70-1 hand piece with TSX713 tip |
| SH232 | Sponge holder with RS199 cleaning sponge |
| Accessory Kit | |
|---|---|
| WT620 | Tip wrench, 1/4” socket |
| WT624 | Tip wrench, dual open end, 1/4” & 5/16” |
| ST706 | SMD tool to lift off SMD’s |
| RB641 | Shim blade replacement |
| WS630 | SMD pull wire with low static spool |
| AN112 | Anti-Seize compound |
| WP556 | WIGAPRY® mini screwdriver and calibration aid tool |
| Specifications | |
|---|---|
| Power Requirements | 230V, 50Hz |
| Power Rating | 39W - 330W |
| Heater Rating | 24V, 70W |
| Weight | 3.1 kg |
| Overall Dimensions | 147 mm x 254 mm x 224 mm |
| Temperature Range | 205°C - 427°C |
| Temperature Regulation | ±3ºC |
| Tip-to-Ground Voltage Leakage/Resistance | < 2mV / < 2 ohms |
| Order code | Type | Place an order |
|---|---|---|
| TSX70-230 | - | {TSX70-230} |
